GlobalFoundries to make key AI chip component for TSMC in $2 billion deal根据一项价值20亿美元的协议，GlobalFoundries将为台积电生产关键人工智能芯片组件。
Oct 8 (Reuters) - GlobalFoundries on Thursday said it has reached a $2 billion agreement to make a key component used to link AI processors and memory chips for TSMC at its New York facility.
FILE PHOTO: The logo of Taiwan Semiconductor Manufacturing Company (TSMC) at the company's second-quarter earnings conference in Taipei, Taiwan, July 16, 2026. REUTERS/Ann Wang/File Photo
Oct 8 (Reuters) - GlobalFoundries on Thursday said it has reached a $2 billion agreement to make a key component used to link AI processors and memory chips for TSMC at its New York facility.
Known as a siliconinterposer, the component sits beneath processors and memory chips inside advanced AI packages and enables them to communicate at high speeds.
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资料照片：2026年7月16日，台积电（TSMC）在台湾台北举行的第二季度财报发布会上展示的台积电标志。路透社/Ann Wang/资料照片
10 月 8 日（路透社）——GlobalFoundries 周四表示，已达成一项价值 20 亿美元的协议，将在其纽约工厂为台积电生产用于连接人工智能处理器和内存芯片的关键组件。
这种被称为硅中介层的组件位于先进人工智能封装中的处理器和内存芯片下方，使它们能够高速通信。
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