Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports据首尔报纸报道，三星将采用台积电技术为英伟达生产下一代内存芯片。
SEOUL, Oct 18 (Reuters) - Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory (HBM) chips, the Seoul Economic Daily reported on Sunday.
FILE PHOTO: File Photo: The logo of Taiwan Semiconductor Manufacturing Company (TSMC) at the company's second-quarter earnings conference in Taipei, Taiwan, July 16, 2026. REUTERS/Ann Wang/File Photo/File Photo
SEOUL, Oct 18 (Reuters) - Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory (HBM) chips, the Seoul Economic Daily reported on Sunday.
The move would mark the first time Samsung has worked with the Taiwanese contract chipmaker at the HBM manufacturing stage, according to the report.
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资料图片：2026年7月16日，台积电（TSMC）在台湾台北举行的第二季度财报发布会上展示的台积电标志。路透社/Ann Wang/资料图片/资料图片
首尔，10 月 18 日（路透社）——据《首尔经济日报》周日报道，三星电子将采用台积电的 3 纳米工艺为英伟达的下一代定制高带宽内存 (HBM) 芯片生产基础芯片。
报道称，此举将标志着三星首次与这家台湾芯片代工制造商在HBM制造阶段展开合作。
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