Hyundai Mobis to test viability of local auto chips

Hyundai Mobis will test the real-world applicability and commercial viability of locally developed automotive semiconductors this year in Seongnam, Gyeonggi Province. The company identified 19 joint system semiconductor projects with Korean companies, with development underway on 13 chips and target vehicle models designated for nine. At its second Auto Semicon Korea forum, 53 companies and institutions discussed localization, next-generation power chips and coordination between industry demand and government support. Hyundai Mobis plans to connect chip development with validation and mass production.

Participation in the forum grew from 27 companies and institutions last year to 53 this year.

Hyundai Mobis mass-produces 16 types of internally designed system semiconductors through external foundries, with combined annual production of about 20 million units.

The company plans to work with automakers to define technical requirements, quality standards, deployment schedules and target vehicle models early in development.

Hyundai Mobis is reviewing joint development opportunities in silicon carbide chips and insulated-gate bipolar transistors.

CEO Lee Gyu-suk said the company would share responsibility with partners from development through verification to mass production.

Published Oct 21, 2026 3:11 pm KST

Updated Oct 21, 2026 3:14 pm KST

Tech players discuss auto chip localization during Auto Semicon Korea

Hyundai Mobis CEO Lee Gyu-suk, center, speaks during a press conference on the sidelines of the Auto Semicon Korea forum in Seongnam, Gyeonggi Province, Wednesday. Courtesy of Hyundai Mobis

Hyundai Mobis will focus on verifying the real-world applicability and commercial viability of locally developed automotive semiconductors this year, as the industry seeks to reduce reliance on overseas suppliers amid the shift toward software-defined vehicles (SDVs), the auto parts maker said Wednesday.

The company identified 19 joint system semiconductor projects with Korean companies over the past year, with development underway on 13 chips. Nine of the 13 have designated target vehicle models, bringing the projects closer to real-world application.

Hyundai Mobis unveiled the progress at its second Auto Semicon Korea forum in Seongnam, Gyeonggi Province. Participation expanded to 53 companies and institutions this year, up from 27 last year, as collaboration widened to include software, chip design intellectual property, packaging, testing and functional safety.

The forum was launched last year to strengthen Korea’s automotive semiconductor supply chain by connecting automakers, parts suppliers, chip designers, foundries and research institutions.

For this year’s event, key participants — including Industry Minister Kim Jung-kwan — discussed concrete measures to localize system semiconductors, develop next-generation power chips and coordinate industry demand with government support.

Last year’s first forum focused on finding opportunities to extend Korean companies’ home appliance, mobile and industrial semiconductor technologies to automotive applications and develop them jointly.

For this year, the discussion has moved into a more advanced stage as participants confirm the potential for actual product development, vehicle application and commercialization, Hyundai Mobis CEO Lee Gyu-suk said during a press conference before the forum.

“Hyundai Mobis will connect each company’s strengths and build a full-cycle collaboration structure in which we share responsibility from development through verification to mass production, so that no individual company has to bear the high barriers to entry in automotive semiconductors on its own,” Lee said.

The company plans to develop the forum into a platform connecting chip demand with development, validation and mass production. It will work with automakers to define technical requirements, quality standards, deployment schedules and target vehicle models early in the development process.

Automotive semiconductors require more than chip-design capabilities, as they must meet strict reliability, quality and functional safety standards before entering mass production.

Hyundai Mobis will help domestic suppliers overcome these barriers by sharing automakers’ requirements and supporting validation at both the controller and vehicle levels.

The company is also pursuing two main areas: system semiconductors, which handle functions, such as communication, sensing and data processing, along with power semiconductors used in electrification systems.

Hyundai Mobis currently mass-produces 16 types of internally designed system semiconductors through external foundries, with combined annual production of about 20 million units. It is also reviewing joint development opportunities in next-generation power semiconductors, including silicon carbide chips and insulated-gate bipolar transistors.

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今年，现代摩比斯将在京畿道城南市测试其自主研发的汽车半导体的实际应用性和商业可行性。该公司已与韩国企业确定了19个联合系统半导体项目，其中13款芯片正在研发中，9款芯片的目标车型已确定。在第二届韩国汽车半导体论坛上，53家企业和机构探讨了本地化、下一代功率芯片以及产业需求与政府支持之间的协调等议题。现代摩比斯计划将芯片研发、验证和量产环节衔接起来。

参加论坛的公司和机构数量从去年的 27 家增加到今年的 53 家。

现代摩比斯通过外部代工厂批量生产16种自主设计的系统半导体，年总产量约为2000万颗。

该公司计划与汽车制造商合作，在研发初期就确定技术要求、质量标准、部署计划和目标车型。

现代摩比斯正在评估在碳化硅芯片和绝缘栅双极晶体管领域的联合开发机会。

CEO李圭硕表示，公司将与合作伙伴共同承担从研发、验证到批量生产的责任。

发布于2026年10月21日下午3:11（韩国标准时间）

更新于2026年10月21日下午3:14（韩国标准时间）

在韩国汽车半导体展上，科技企业探讨了汽车芯片本地化问题。

现代摩比斯首席执行官李圭硕（中）周三在京畿道城南市举行的韩国汽车半导体论坛间隙举行的新闻发布会上发表讲话。图片由现代摩比斯提供。

现代摩比斯汽车公司周三表示，今年该公司将专注于验证本地开发的汽车半导体的实际应用性和商业可行性，因为随着汽车行业向软件定义汽车（SDV）转型，该行业正在寻求减少对海外供应商的依赖。

过去一年，该公司与韩国企业确定了19个联合系统半导体项目，其中13个芯片的研发工作正在进行中。这13个芯片中有9个已指定目标车型，使这些项目更接近实际应用。

现代摩比斯在京畿道城南市举行的第二届韩国汽车半导体论坛上公布了最新进展。与去年的27家公司和机构相比，今年的参会企业和机构数量增加到53家，合作范围也扩大到软件、芯片设计知识产权、封装、测试和功能安全等领域。

该论坛于去年启动，旨在通过连接汽车制造商、零部件供应商、芯片设计商、代工厂和研究机构，加强韩国的汽车半导体供应链。

在今年的活动中，包括产业通商资源部长官金正宽在内的主要参与者讨论了实现系统半导体本地化、开发下一代功率芯片以及协调产业需求与政府支持的具体措施。

去年的首届论坛重点探讨了如何将韩国公司的家用电器、移动和工业半导体技术扩展到汽车应用领域，并进行联合开发。

现代摩比斯首席执行官李圭硕在论坛前的新闻发布会上表示，今年的讨论已经进入了更深入的阶段，参与者确认了实际产品开发、车辆应用和商业化的潜力。

李表示：“现代摩比斯将整合各公司的优势，构建一个全周期的合作架构，从研发、验证到量产，我们共同承担责任，这样任何一家公司都不必独自承担汽车半导体领域高昂的准入门槛。”

该公司计划将该论坛发展成为一个连接芯片需求与研发、验证和量产的平台。它将与汽车制造商合作，在研发初期就确定技术要求、质量标准、部署计划和目标车型。

汽车半导体需要的不仅仅是芯片设计能力，它们在投入大规模生产之前还必须满足严格的可靠性、质量和功能安全标准。

现代摩比斯将通过分享汽车制造商的要求并支持控制器和车辆层面的验证，帮助国内供应商克服这些障碍。

该公司还在两个主要领域进行研发：系统半导体（用于处理通信、传感和数据处理等功能）以及用于电气化系统的功率半导体。

现代摩比斯目前通过外部代工厂批量生产16种自主设计的系统半导体，年产量合计约2000万颗。该公司还在评估下一代功率半导体（包括碳化硅芯片和绝缘栅双极型晶体管）的联合开发机会。

现代摩比斯在斯洛伐克开设新的电动汽车零部件工厂

现代摩比斯携供应商展示人工智能和机器人制造技术