Nvidia adds Samsung Electro-Mechanics to substrate supply chain, plans capacity expansion in S. Korea

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WASHINGTON, Oct. 21 (Yonhap) -- U.S. chip giant Nvidia Corp. said Wednesday that South Korea's Samsung Electro-Mechanics Co. is joining its semiconductor substrate supply chain as part of a broader initiative to expand manufacturing capacity.

Samsung Electro-Mechanics, the electronic components unit of Samsung Electronics Co., will initially provide production capacity from its existing operations in South Korea, while the collaboration will also support facility upgrades and new factories in Sejong and Busan, South Korea, according to Nvidia.

By 2028, production allocated to Nvidia is projected to account for a significant portion of Samsung Electro-Mechanics' total annual package substrate production capacity, the U.S. company said.

The South Korean company also issued a separate press release, calling the deal a strategic business partnership to strengthen the global artificial intelligence (AI) semiconductor supply chain.

Samsung Electro-Mechanics said it plans to supply Nvidia with package substrates for AI semiconductors under a multiyear agreement beginning in 2026.

Separately, Nvidia and U.S.-based Amkor Technology Inc. plan to expand advanced semiconductor packaging capacity in South Korea, targeting an increase of more than 300 percent in interposer wafer capacity by the end of 2028, the U.S. company said.

The planned expansion, alongside Amkor Technology's development of new manufacturing facilities in South Korea, will support higher production volumes for Nvidia's current and next-generation platforms.

The announcements were part of Nvidia's broader initiative unveiled at its GTC event in Berlin to expand global manufacturing capacity with suppliers amid growing demand for AI computing infrastructure.

Nvidia said agreements with Samsung Electro-Mechanics, Japan's Ibiden Co. and Taiwan's Unimicron Technology Corp. would contribute to its plan to increase substrate capacity for its products by 2.5 times over the next three years.

This composite image shows the corporate logos of Samsung Electro-Mechanics and Nvidia. (PHOTO NOT FOR SALE) (Yonhap)

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Nvidia adds Samsung Electro-Mechanics to substrate supply chain, plans capacity expansion in S. Korea

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华盛顿，10 月 21 日（韩联社）——美国芯片巨头英伟达公司周三表示，韩国三星电机公司将加入其半导体基板供应链，这是该公司扩大制造能力的更广泛计划的一部分。

据英伟达称，三星电子旗下电子元件部门三星电机将首先利用其在韩国的现有工厂提供产能，同时此次合作还将支持在韩国世宗和釜山进行工厂升级和新建工厂。

三星电机表示，到 2028 年，分配给英伟达的产能预计将占三星电机年度封装基板总产能的很大一部分。

这家韩国公司还单独发布了一份新闻稿，称该交易是一项战略业务合作，旨在加强全球人工智能 (AI) 半导体供应链。

三星电机表示，计划从 2026 年开始，根据一项多年协议，向英伟达供应用于人工智能半导体的封装基板。

此外，英伟达表示，该公司与总部位于美国的安靠科技公司计划在韩国扩大先进半导体封装产能，目标是到 2028 年底将中介层晶圆产能提高 300% 以上。

此次扩建计划，加上 Amkor Technology 在韩国开发新的制造设施，将支持英伟达当前和下一代平台更高的产量。

这些公告是英伟达在柏林举行的 GTC 大会上公布的更广泛计划的一部分，旨在与供应商合作，扩大全球制造能力，以满足不断增长的人工智能计算基础设施需求。

英伟达表示，与三星电机、日本Ibiden公司和台湾Unimicron科技公司的协议将有助于其在未来三年内将其产品基板产能提高2.5倍的计划。

这张合成图片展示了三星电机和英伟达两家公司的标志。（图片非卖品）（韩联社）

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英伟达将三星电机纳入基板供应链，并计划在韩国扩大产能。