Nvidia broadens ties with Korean component makers

Nvidia expanded partnerships with LG Innotek and Samsung Electro-Mechanics at the GPU Technology Conference in Berlin on Tuesday, strengthening its supply chain for physical AI and next-generation infrastructure. LG Innotek presented sensing solutions using Nvidia’s Holoscan Sensor Bridge technology and plans further development for robotics. Samsung Electro-Mechanics will supply Nvidia with advanced semiconductor package substrates under a multiyear agreement beginning in 2026.

LG Innotek’s showcased products include 3-megapixel camera modules and a multimodal vision system combining multiple cameras and sensors.

Holoscan Sensor Bridge sends sensor data directly to AI computers, bypassing the central processing unit.

LG Innotek plans to develop sensing solutions compatible with Nvidia’s next-generation platforms and showcase them at CES and GTC next year.

Samsung Electro-Mechanics will establish dedicated substrate production lines at facilities in Sejong and Busan.

Samsung Electro-Mechanics estimates its annual substrate supplies to Nvidia will grow by double digits on average from 2026, with Nvidia-related orders expected to account for a substantial share of its total package substrate production capacity by 2028.

Published Oct 22, 2026 3:08 pm KST

LG Innotek develops sensing solutions while Samsung Electro-Mechanics ramps up substrate production

LG Innotek's headquarters in Gangseo District, Seoul / Courtesy of LG Innotek

Nvidia is expanding partnerships with domestic component makers LG Innotek and Samsung Electro-Mechanics, strengthening its supply chain for physical artificial intelligence (AI) applications and next-generation AI infrastructure.

LG Innotek unveiled a lineup of sensing solutions incorporating Nvidia's latest Holoscan Sensor Bridge (HSB) technology at the U.S. chipmaker's annual GPU Technology Conference (GTC) in Berlin on Tuesday (local time).

The solutions include 3-megapixel camera modules and a multimodal vision system that combines multiple cameras and sensors, targeting applications in physical AI and robotics.

Nvidia's HSB technology allows sensor data to be sent directly to AI computers, bypassing the central processing unit and potentially speeding up how robots and autonomous vehicles process information and make decisions.

The partnership reflects growing demand for advanced sensing technologies as AI expands beyond software and data centers into physical environments, where machines must perceive and respond to their surroundings in real time.

LG Innotek said it plans to expand collaboration with Nvidia on HSB-based sensing solutions for humanoid robot vision systems and robotic hands. The companies also plan to develop sensing solutions compatible with Nvidia's next-generation platforms and showcase them at CES and GTC next year.

“This collaboration is a valuable opportunity to bring LG Innotek’s differentiated integrated sensing solutions to global markets,” the company’s CEO Moon Hyuk-soo said.

“As a total solution provider for physical AI, encompassing not only sensing but also communication modules and semiconductor substrates, we will move quickly to establish a leading position in the physical AI solutions market.”

Separately, Samsung Electro-Mechanics announced a strategic business partnership with Nvidia to expand production of advanced semiconductor package substrates for AI chips and data center network switches.

Samsung Electro-Mechanics' manufacturing site in Suwon, Gyeonggi Province / Courtesy of Samsung Electro-Mechanics

The companies will jointly fund new production capacity, with Samsung Electro-Mechanics set to begin supplying Nvidia with the substrates in 2026 under a multiyear agreement.

Samsung Electro-Mechanics will establish dedicated production lines at its facilities in Sejong and Busan to manufacture substrates for Nvidia's computing chips and network switches used to connect chips at high speeds in data centers.

The company estimates its annual substrate supplies to Nvidia to grow by double digits on average from 2026. By 2028, Nvidia-related orders are expected to account for a substantial share of the company's total package substrate production capacity.

Advanced substrates are becoming increasingly important as AI chips grow more complex and require greater computing power, tighter power control and more efficient data transmission. The company said its manufacturing technologies include fine-line circuit fabrication and embedding passive components, such as multilayer ceramic capacitors and silicon capacitors, in substrates.

"The pace of the AI infrastructure buildout requires us to expand manufacturing capacity on a global scale,” Nvidia Executive Vice President of Operations Debora Shoquist said.

“Our work with Samsung Electro-Mechanics broadens our network of substrate partners and adds manufacturing capacity to help us scale production and deliver the accelerated computing platforms our customers need."

周二在柏林举行的GPU技术大会上，英伟达扩大了与LG Innotek和三星电机（Samsung Electro-Mechanics）的合作关系，进一步加强了其在物理人工智能和下一代基础设施领域的供应链。LG Innotek展示了基于英伟达Holoscan传感器桥接技术的传感解决方案，并计划进一步开发该技术在机器人领域的应用。根据一项自2026年起生效的多年协议，三星电机将向英伟达供应先进的半导体封装基板。

LG Innotek 展示的产品包括 300 万像素摄像头模块和结合多个摄像头和传感器的多模态视觉系统。

Holoscan传感器桥直接将传感器数据发送到人工智能计算机，绕过中央处理器。

LG Innotek 计划开发与英伟达下一代平台兼容的传感解决方案，并于明年在 CES 和 GTC 上展示。

三星电机将在世宗和釜山的工厂建立专用基板生产线。

三星电机预计，从 2026 年开始，其每年向英伟达供应的基板数量将平均增长两位数，到 2028 年，与英伟达相关的订单预计将占其总封装基板产能的很大一部分。

发布于2026年10月22日下午3:08（韩国标准时间）

LG Innotek 致力于研发传感解决方案，而三星电机则加大基板生产力度。

LG Innotek位于首尔江西区的总部 / 图片由LG Innotek提供

英伟达正在扩大与国内零部件制造商 LG Innotek 和三星电机的合作关系，以加强其物理人工智能 (AI) 应用和下一代 AI 基础设施的供应链。

LG Innotek 于周二（当地时间）在柏林举行的美国芯片制造商英伟达年度 GPU 技术大会 (GTC) 上，推出了一系列采用英伟达最新 Holoscan 传感器桥 (HSB) 技术的传感解决方案。

该解决方案包括 300 万像素摄像头模块和多模态视觉系统，该系统结合了多个摄像头和传感器，目标是物理人工智能和机器人领域的应用。

英伟达的 HSB 技术允许将传感器数据直接发送到 AI 计算机，绕过中央处理器，从而有可能加快机器人和自动驾驶汽车处理信息和做出决策的速度。

此次合作反映出，随着人工智能从软件和数据中心扩展到物理环境，对先进传感技术的需求日益增长，机器必须实时感知并响应周围环境。

LG Innotek表示，计划扩大与Nvidia在基于HSB的传感解决方案方面的合作，这些解决方案将应用于人形机器人视觉系统和机械手。两家公司还计划开发与Nvidia下一代平台兼容的传感解决方案，并于明年在CES和GTC展会上进行展示。

“此次合作是把LG Innotek差异化的集成传感解决方案推向全球市场的宝贵机会，”公司首席执行官文赫洙表示。

“作为一家提供物理人工智能整体解决方案的供应商，我们的产品不仅包括传感技术，还包括通信模块和半导体基板，我们将迅速行动，在物理人工智能解决方案市场确立领先地位。”

此外，三星电机宣布与英伟达建立战略业务合作伙伴关系，以扩大用于人工智能芯片和数据中心网络交换机的先进半导体封装基板的生产。

三星电机位于京畿道水原市的生产基地 / 图片由三星电机提供

两家公司将共同出资建设新的产能，根据一项多年协议，三星电机将于 2026 年开始向英伟达供应基板。

三星电机将在其位于世宗和釜山的工厂建立专用生产线，为英伟达的计算芯片和用于在数据中心高速连接芯片的网络交换机生产基板。

该公司预计，从 2026 年起，其向英伟达提供的年度基板供应量将平均以两位数的速度增长。到 2028 年，与英伟达相关的订单预计将占该公司封装基板总产能的很大一部分。

随着人工智能芯片日益复杂，对计算能力、功耗控制和数据传输效率的要求也越来越高，先进衬底的重要性也日益凸显。该公司表示，其制造技术包括精细电路制造以及将多层陶瓷电容器和硅电容器等无源元件嵌入衬底中。

英伟达运营执行副总裁黛博拉·肖奎斯特表示：“人工智能基础设施建设的步伐要求我们在全球范围内扩大制造能力。”

“我们与三星电机公司的合作扩大了我们的基板合作伙伴网络，并增加了制造能力，以帮助我们扩大生产规模，并交付客户所需的加速计算平台。”