Wall Street banks, Blackstone line up $63 billion to finance Broadcom chips for Anthropic华尔街银行和黑石集团筹集了630亿美元,为Anthropico公司提供博通芯片的融资。
Oct 26 (Reuters) - Bank of America, Blackstone, Citi and Morgan Stanley will provide $63 billion in financing to buy Broadcom's AI chips and networking gear for Anthropic, the companies said on Monday, in one of the largest debt deals tied to the AI buildout.

Broadcom logo is seen in this illustration taken June 11, 2026. REUTERS/Dado Ruvic/Illustration
Oct 26 (Reuters) - Bank of America, Blackstone, Citi and Morgan Stanley will provide $63 billion in financing to buy Broadcom's AI chips and networking gear for Anthropic, the companies said on Monday, in one of the largest debt deals tied to the AI buildout.
(Reporting by Aditya Soni in Bengaluru; Editing by Pooja Desai)
Thank you for your report!
China moves to set global standards for brain-computer interface technology
Malaysia to station RM40m Japanese anti-drone technology in Sepanggar, Labuan
Proposed export curbs target advanced solar technologies
这张摄于2026年6月11日的插图展示了博通公司的标志。路透社/Dado Ruvic/插图
10 月 26 日(路透社)——美国银行、黑石集团、花旗集团和摩根士丹利周一表示,将提供 630 亿美元的融资,用于购买博通公司的人工智能芯片和网络设备,供 Anthropic 公司使用。这是与人工智能建设相关的最大债务交易之一。
(Aditya Soni在班加罗尔报道;Pooja Desai编辑)
感谢您的报告!
中国着手制定脑机接口技术的全球标准
马来西亚将在纳闽实邦加部署价值 4000 万令吉的日本反无人机技术
拟议的出口限制措施针对先进太阳能技术