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Wall Street banks, Blackstone line up $63 billion to finance Broadcom chips for Anthropic

Oct ⁠26 (Reuters) - Bank ⁠of America, ‌Blackstone, Citi and Morgan Stanley ​will provide $63 ⁠billion ⁠in financing to ⁠buy Broadcom's ‌AI ⁠chips and networking ​gear ‌for Anthropic, ⁠the ​companies said on ⁠Monday, in one ​of the largest debt ⁠deals tied to the AI ​buildout.

The Star MalaysiaReuters查看原文 ↗
华尔街银行和黑石集团筹集了630亿美元,为Anthropico公司提供博通芯片的融资。

Broadcom logo is seen in this illustration taken June 11, 2026. REUTERS/Dado Ruvic/Illustration

Oct ⁠26 (Reuters) - Bank ⁠of America, ‌Blackstone, Citi and Morgan Stanley ​will provide $63 ⁠billion ⁠in financing to ⁠buy Broadcom's ‌AI ⁠chips and networking ​gear ‌for Anthropic, ⁠the ​companies said on ⁠Monday, in one ​of the largest debt ⁠deals tied to the AI ​buildout.

(Reporting ⁠by Aditya ​Soni in ‌Bengaluru; Editing ​by Pooja Desai)

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