Samsung chief visits Advanced Package Lab in Japan

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SEOUL, Nov. 1 (Yonhap) -- Samsung Electronics Co. Chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Japan, which is designed to serve as a global research and development (R&D) hub for technologies that enhance the performance of artificial intelligence (AI) chips, the company said Sunday.

Samsung Electronics said it held an opening ceremony for the Yokohama-based APL in September.

The facility focuses on developing and validating key technologies, including materials and processes, required for advanced semiconductor packaging by leveraging Japan's strengths in materials, components and equipment, the company said in a press release.

During a meeting with APL researchers, Lee discussed progress in developing key materials and process technologies for advanced packaging, as well as ways to strengthen cooperation with Japanese companies in the materials, components and equipment sectors, it said.

He stressed the importance of securing advanced packaging technologies, which are essential to maintaining competitiveness in the semiconductor industry in the age of AI, the company said.

Samsung established the APL in 2023 and spent the following two years preparing the facility and conducting initial R&D activities ahead of its official opening in September, a company spokesperson said.

The company plans to invest 350 billion won (US$262 million) in the R&D facility over five years through 2028.

This photo, taken Nov. 1, 2026, and provided by Samsung Electronics Co., shows Samsung Electronics Chairman Lee Jae-yong (C) speaking with executives at its Advanced Package Lab (APL) in Yokohama, Japan. (PHOTO NOT FOR SALE) (Yonhap)

kyongae.choi@yna.co.kr (END)

Samsung chief visits Advanced Package Lab in Japan

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首尔，11月1日（韩联社）——三星电子公司周日表示，公司董事长李在镕访问了位于日本的三星先进封装实验室（APL）。该实验室旨在成为全球研发中心，致力于开发能够提升人工智能芯片性能的技术。

三星电子表示，已于9月为位于横滨的APL举行了开业典礼。

该公司在一份新闻稿中表示，该设施专注于利用日本在材料、组件和设备方面的优势，开发和验证先进半导体封装所需的关键技术，包括材料和工艺。

报道称，李在与APL研究人员会面时，讨论了先进包装关键材料和工艺技术的开发进展，以及如何加强与日本公司在材料、零部件和设备领域的合作。

该公司表示，他强调了确保先进封装技术的重要性，这对于在人工智能时代保持半导体行业的竞争力至关重要。

三星发言人表示，三星于 2023 年成立了 APL，并在接下来的两年里为该设施的筹备和初步研发活动做准备，之后于 9 月份正式开放。

该公司计划在2028年之前的五年内，向该研发设施投资3500亿韩元（2.62亿美元）。

这张照片由三星电子公司提供，拍摄于2026年11月1日，照片显示三星电子董事长李在镕（中）在日本横滨的先进封装实验室（APL）与高管交谈。（照片不得出售）（韩联社）

kyongae.choi@yna.co.kr (完)

三星总裁访问日本先进封装实验室