Bosch to spin off semiconductor division in January 2028博世将于2028年1月分拆半导体业务部门
Nov 3 (Reuters) - Bosch, the world's top automotive supplier, will spin off its semiconductor division in January 2028, it said on Tuesday.
FILE PHOTO: The Bosch logo is reflected in a semiconductor wafer in the company manufacturing base in Reutlingen, Germany, June 16, 2017. REUTERS/Michaela Rehle/File Photo
Nov 3 (Reuters) - Bosch, the world's top automotive supplier, will spin off its semiconductor division in January 2028, it said on Tuesday.
• The German firm said it aims to increase sales of the small components used in cars and e-bikes to 5 billion euros ($5.59 billion) by 2030
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资料照片：2017年6月16日，德国罗伊特林根，博世公司制造基地内，博世标志倒映在半导体晶圆上。（路透社/Michaela Rehle/资料照片）
11月3日（路透社）——全球最大的汽车供应商博世周二表示，将于2028年1月分拆其半导体部门。
• 这家德国公司表示，其目标是到2030年将用于汽车和电动自行车的小型零部件的销售额提高到50亿欧元（55.9亿美元）。
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