Samsung Electro-Mechanics to invest $3.14 bil. for substrate plant in Sejong

Samsung Electro-Mechanics will invest 4.27 trillion won in Sejong to expand semiconductor substrate production, marking its largest capital expenditure on a single product. The project targets flip chip ball grid array substrates for AI servers, with investment running from September 2026 through May 2028 and mass production set for September 2028. The plan is part of the company’s broader investment commitment in Chungcheong and Busan through 2040.

The Sejong investment is worth 4.27 trillion won, or $3.14 billion, and is the company’s largest single-product capital expenditure on record.

The expansion is for flip chip ball grid array substrates, which connect high-performance chips to mainboards and supply power and signals.

The investment period runs from September 2026 to May 2028, and mass production on the new lines is scheduled to begin in September 2028.

Samsung Electro-Mechanics said the project is tied to medium- to long-term partnerships with global Big Tech customers that include financial support and guaranteed long-term demand.

The company also said the investment is part of a July commitment to invest 8 trillion won in the Chungcheong region and 15 trillion won in Busan by 2040.

Published Sep 28, 2026 6:58 pm KST

Samsung Electro-Mechanics' flip chip ball grid array for servers / Courtesy of Samsung Electro-Mechanics

Samsung Electro-Mechanics said Monday it will invest 4.27 trillion won ($3.14 billion) to expand its semiconductor substrate production capacity at its plant in Sejong, marking the largest amount of capital expenditure on a single product in the company’s history.

According to its regulatory filing, the company will expand its production capacity for flip chip ball grid array (FC-BGA) substrates at the Sejong plant to meet growing demand from artificial intelligence (AI) servers.

The investment will run from September 2026 through May 2028, with mass production on the new lines scheduled to begin in September 2028.

This is part of the company’s commitment announced in July that it will invest 8 trillion won in the nation's central Chungcheong region, which includes Sejong, and 15 trillion won in the Busan area by 2040.

FC-BGA is a highly integrated semiconductor substrate that connects high-performance chips — such as AI accelerators, graphics processing units and central processing units — to mainboards, transmitting electrical signals and supplying power.

Demand for FC-BGA substrates has surged amid the rapid expansion of global AI infrastructure, prompting Samsung Electro-Mechanics to expand production to meet growing demand secured mainly through long-term agreements.

Samsung Electro-Mechanics said the investment will help it address growing demand for high-value semiconductor substrates in high-growth markets, including AI servers, high-performance computing and automotive applications.

The company added that the investment is based on medium- to long-term partnerships with global Big Tech customers, which includes financial supports and a guarantee for long-term demand. Through this, the company expects to secure a stable demand base and strengthen its competitiveness in the FC-BGA business.

“The importance of high-value semiconductor substrates is growing rapidly as they become key components determining semiconductor performance and supply chain stability amid the rapid growth of the AI and high-performance computing markets,” Samsung Electro-Mechanics CEO Chang Duck-hyun said.

“Based on our differentiated substrate technologies and stable supply capabilities, we will strengthen our competitiveness in the FC-BGA business across high-growth markets, including AI, servers and automotive applications.”

三星电机将在世宗投资4.27万亿韩元，用于扩大半导体基板生产，这将是该公司迄今为止在单一产品上的最大一笔资本支出。该项目旨在生产用于人工智能服务器的倒装芯片球栅阵列基板，投资期为2026年9月至2028年5月，预计将于2028年9月开始量产。该计划是三星电机在忠清道和釜山地区持续投资计划的一部分，该计划将持续到2040年。

世宗集团的投资额为 4.27 万亿韩元，约合 31.4 亿美元，是该公司有史以来最大的单项产品资本支出。

此次扩展适用于倒装芯片球栅阵列基板，该基板可将高性能芯片连接到主板，并提供电源和信号。

投资期为 2026 年 9 月至 2028 年 5 月，新生产线计划于 2028 年 9 月开始批量生产。

三星电机表示，该项目与全球大型科技客户的中长期合作关系有关，其中包括资金支持和长期需求保障。

该公司还表示，这项投资是其在7月份做出的承诺的一部分，即到2040年向忠清地区投资8万亿韩元，向釜山投资15万亿韩元。

发布于2026年9月28日 下午6:58（韩国标准时间）

三星电机用于服务器的倒装芯片球栅阵列 / 图片由三星电机提供

三星电机周一表示，将投资 4.27 万亿韩元（31.4 亿美元）扩大其位于世宗市工厂的半导体基板生产能力，这是该公司历史上对单一产品的最大资本支出。

根据其监管文件，该公司将在世宗工厂扩大其倒装芯片球栅阵列 (FC-BGA) 基板的产能，以满足人工智能 (AI) 服务器日益增长的需求。

该投资项目将从 2026 年 9 月持续到 2028 年 5 月，新生产线的大规模生产计划于 2028 年 9 月开始。

这是该公司在 7 月份宣布的承诺的一部分，即到 2040 年，该公司将在包括世宗市在内的韩国中部忠清地区投资 8 万亿韩元，在釜山地区投资 15 万亿韩元。

FC-BGA 是一种高度集成的半导体基板，它将高性能芯片（例如 AI 加速器、图形处理单元和中央处理单元）连接到主板，传输电信号并提供电源。

随着全球人工智能基础设施的快速扩张，对 FC-BGA 基板的需求激增，促使三星电机扩大生产以满足不断增长的需求，而这些需求主要通过长期协议来保障。

三星电机表示，这项投资将帮助其满足高增长市场（包括人工智能服务器、高性能计算和汽车应用）对高价值半导体基板日益增长的需求。

该公司补充道，这项投资基于与全球大型科技客户建立的中长期合作伙伴关系，其中包括资金支持和长期需求保障。通过这种方式，该公司期望确保稳定的需求基础，并增强其在燃料电池-BGA业务领域的竞争力。

三星电机首席执行官张德铉表示：“随着人工智能和高性能计算市场的快速增长，高价值半导体衬底的重要性正在迅速增长，因为它们正成为决定半导体性能和供应链稳定性的关键组件。”

“凭借我们差异化的基板技术和稳定的供应能力，我们将增强我们在高增长市场（包括人工智能、服务器和汽车应用）的 FC-BGA 业务竞争力。”