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Wolfspeed secures $1.5 billion conditional loan commitment from US defense department

Oct 7 (Reuters) - Chipmaker ⁠Wolfspeed said on Wednesday it has ⁠received a conditional loan commitment for up ‌to $1.5 billion from the US Department of Defense to expand domestic production of silicon carbide materials and power devices, ​sending its shares surging 27% ⁠in extended trading.

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Wolfspeed公司从美国国防部获得15亿美元的有条件贷款承诺

U.S. power chip maker Wolfspeed’s silicon carbide 200mm wafer is seen on display at Wolfspeed’s Mohawk Valley Fab in Marcy, New York, U.S., April 2022. Courtesy of Wolfspeed/Handout via REUTERS/File Photo

Oct 7 (Reuters) - Chipmaker ⁠Wolfspeed said on Wednesday it has ⁠received a conditional loan commitment for up ‌to $1.5 billion from the USDepartment of Defense to expand domestic production of silicon carbide materials and power devices, ​sending its shares surging 27% ⁠in extended trading.

• ⁠Wolfspeed makes chips using silicon carbide, which are ⁠more ‌energy-efficient and used in applications that require huge amounts of power conversion ⁠such as electric vehicles, solar inverters and ​industrial ‌power systems

• The company said the conditional ⁠30-year commitment, ​through the defense department's Office of Strategic Capital, reflects its efforts to optimize its capital ⁠structure and improve its financial foundation

• ​It plans to use the financing to upgrade its gallium nitride technology for next-generation communications ⁠infrastructure and electronic warfare systems and develop radiation-hardening capabilities

• The funding is subject to due diligence, definitive agreements, government approvals and other ​conditions

• Under the proposed terms, ⁠Wolfspeed would be required to issue to ​the department warrants to purchase ‌up to 7.5% of ​Wolfspeed's fully diluted equity

(Reporting by Dharna Bafna in Bengaluru; Editing by Shilpi Majumdar)

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