Taiwan breaks ground on advanced packaging park anchored by TSMC台湾破土动工兴建以台积电为核心的先进封装产业园
TAIPEI, Sept 21 (Reuters) - Taiwan broke ground on a new advanced packaging industrial park in the southern city of Kaohsiung on Monday, where TSMC plans to establish facilities for technology validation and talent training.
The logo of Taiwan Semiconductor Manufacturing Company (TSMC) at the company's second-quarter earnings conference in Taipei, Taiwan, July 16, 2026. REUTERS/Ann Wang
TAIPEI, Sept 21 (Reuters) - Taiwan broke ground on a new advanced packaging industrial park in the southern city of Kaohsiung on Monday, where TSMC plans to establish facilities for technology validation and talent training.
TSMC, the world's largest contract chipmaker, will build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre, Kaohsiung Deputy Mayor Lo Ta-sheng said at the groundbreaking ceremony. The facilities are expected to begin operations in the fourth quarter of 2029.
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2026年7月16日，台积电（TSMC）在台湾台北举行的第二季度财报发布会上展示的台积电标志。（路透社/Ann Wang摄）
台北，9 月 21 日（路透社）——台湾周一在南部城市高雄举行了新的先进封装产业园的奠基仪式，台积电计划在此建立技术验证和人才培训设施。
全球最大的芯片代工制造商台积电将在百浦工业园兴建两座大楼，包括一座技术验证实验室和一座人才培训中心。高雄市副市长罗大生在奠基仪式上宣布了这一消息。预计这些设施将于2029年第四季度投入使用。
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